UV Release Dicing Tape PO Film for MLCC Ceramic Sheet Cutting, Wafer Grinding, LED, Semiconductor - Products

UV Release Dicing Tape PO Film for MLCC Ceramic Sheet Cutting, Wafer Grinding, LED, Semiconductor

2017-08-06 01:06 Visit:187

Price:Unfilled

Model Number: UPT152 Key Specifications/Special Features: Total thickness: 170umPO film, backing thickness: 150um, 207 PSA adhesiveMLCC cutting process Adhesion (before UV radiation) 1.11kg/inch, adhesion (after UV radiation) 20g/inchTack: 10 (ball/no)Peel off forces: 5g/inch Shipping Information: FOB Port: Taiwan

Main Export Markets:

Mid East/Africa
North America

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Contact information

Company:Tianjin Jinmao Group Co. Ltd
Status:Offline Send a letter
Name:solarplus(Ms.)
Tel: (86 22) 26662065 Ext:8045 (86 22) 26667112
Fax: (86 22) 2666 4067 / (86 22) 2666 7119
Area:Beijing
Address:980 East Jinwei Rd., Beichen, Tianjin, Tianjin, China (300402)
Zip code:000000
Mail:[email protected]
Linkurl:http://solarplus.jackytimes-gift.com/