UV Release Dicing Tape PO Film for MLCC Ceramic Sheet Cutting, Wafer Grinding, LED, Semiconductor
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Price:
Negotiable
- minimum:
- Total supply:
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Delivery term:
The date of payment from buyers deliver within days
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seat:
Beijing
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Validity to:
Long-term effective
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Last update:
2017-08-06 01:06
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Browse the number:
187
Company Profile
By certification [File Integrity]
Contact: solarplus(Ms.)
Email: 
Telephone: (86 22) 26662065 Ext:8045 (86 22) 26667112
Area: Beijing
Address: 980 East Jinwei Rd., Beichen, Tianjin, Tianjin, China (300402)
Product details
Model Number: UPT152
Key Specifications/Special Features:
Total thickness: 170umPO film, backing thickness: 150um, 207 PSA adhesiveMLCC cutting process Adhesion (before UV radiation) 1.11kg/inch, adhesion (after UV radiation) 20g/inchTack: 10 (ball/no)Peel off forces: 5g/inch
Shipping Information:
FOB Port:
Taiwan
Main Export Markets:
- Mid East/Africa
- North America
